PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Saved in:
Bibliographic Details
Main Authors LEE, Jin Hak, JEONG, In Ho, HWANG, Jung Ho, KWON, Soon Gyu, LEE, Han Su, BAE, Yun Mi, LEE, Sang Young, CHOI, Dae Young, KIM, Sang Hwa, JEONG, Dong Hun
Format Patent
LanguageEnglish
Published 07.05.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
Bibliography:Application Number: US201916717679