THIN LED FLASH FOR CAMERA

A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is monunted on the flex circuit. The LED die has a thick transparent substrate forming a "top" exit window so at least 40% of the light emitted from the die is side light. A ph...

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Bibliographic Details
Main Author Butterworth, Mark Melvin
Format Patent
LanguageEnglish
Published 23.04.2020
Subjects
ACCESSORIES THEREFOR
APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
PHOTOGRAPHY
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is monunted on the flex circuit. The LED die has a thick transparent substrate forming a "top" exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex furface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.
Bibliography:Application Number: US201916717781