Integrated Sensors And Circuitry

An apparatus is described. The apparatus including a substrate; one or more sensor components formed on the substrate; and one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.

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Bibliographic Details
Main Authors Olsen, Clark T, Ribar, Jeffery G, Davis, Michael W
Format Patent
LanguageEnglish
Published 19.03.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
PRINTED CIRCUITS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Summary:An apparatus is described. The apparatus including a substrate; one or more sensor components formed on the substrate; and one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.
Bibliography:Application Number: US201916572509