Multi-Pin Dense Array Resistivity Probe

• Main Authors: Johnson, III, Walter H, Shi, Zhu-bin, Cui, Jianli, Zhang, Zhuoxian, You, Haiyang, Zhang, Fan, Liu, Xianghua, Shi, Jianou, Yu, Lu, Zhu, Nanchang
• Format: Patent
• Language: English
• Published: 05.03.2020
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.