CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A chemical mechanical polishing apparatus includes a polishing head, including a polishing head body, a membrane attached to a lower portion of the polishing head body, and a reflector disposed between the polishing head body and the membrane, a platen including an opening, an emitter disposed below...

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Bibliographic Details
Main Authors KIM, Sung Hyup, OH, Sang Yeon, CHOI, Ji Min, LEE, Ji Min, HONG, Eun Kyung, KOO, Nam Il, JEON, Ik Seon
Format Patent
LanguageEnglish
Published 05.03.2020
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:A chemical mechanical polishing apparatus includes a polishing head, including a polishing head body, a membrane attached to a lower portion of the polishing head body, and a reflector disposed between the polishing head body and the membrane, a platen including an opening, an emitter disposed below the opening of the platen, the emitter configured to emit terahertz waves, a detector disposed below the opening of the platen, the detector configured to receive the terahertz waves emitted by the emitter and reflected by the reflector, and an analyzer configured to analyze an electrical signal generated by converting the terahertz waves received by the detector, the analyzer configured to determine a polishing end point.
Bibliography:Application Number: US201916268753