LASER PEENING PROCESSING DEVICE AND LASER PEENING PROCESSING METHOD

A laser peening processing device includes a laser oscillator configured to oscillate a laser beam; and a nozzle configured to inject liquid to a workpiece for laser peening processing, and to cause the laser beam to be incident on the liquid to irradiate the workpiece with the laser beam which prop...

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Bibliographic Details
Main Authors MUTO, Masahiko, OGUMA, Yoshitomo
Format Patent
LanguageEnglish
Published 20.02.2020
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A laser peening processing device includes a laser oscillator configured to oscillate a laser beam; and a nozzle configured to inject liquid to a workpiece for laser peening processing, and to cause the laser beam to be incident on the liquid to irradiate the workpiece with the laser beam which propagates through the liquid. The nozzle includes a lens configured to concentrate the laser beam so that a focal point of the laser beam is formed at a processing position of the laser peening processing, a cylindrical casing configured to protect the laser beam before the laser beam is incident on the liquid, and a pipe disposed in the casing and configured to form a flow path for the liquid.
Bibliography:Application Number: US201916403042