TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSCURING CIRCUIT LAYOUT

• Main Authors: BUSBY, James A, LONG, David C, DANGLER, John R, FISHER, Michael J
• Format: Patent
• Language: English
• Published: 06.02.2020
• Subjects: CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; PHYSICS; PRINTED CIRCUITS; TESTING

Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. The at least one interconnect element is undetectable by x-ray, and the conductive lines are detectable by x-ray. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.