CONNECTION STRUCTURE
A connection structure of the present disclosure includes first and second superconducting wires that are two superconducting wires each having a substrate in a tape shape, an intermediate layer formed on the substrate, and a superconductor layer formed on the intermediate layer, a connecting superc...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
23.01.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A connection structure of the present disclosure includes first and second superconducting wires that are two superconducting wires each having a substrate in a tape shape, an intermediate layer formed on the substrate, and a superconductor layer formed on the intermediate layer, a connecting superconductor layer that connects the first and second superconducting wires in a positional relationship in which surfaces of the superconductor layers face each other, and forms a superconducting connecting section together with the first and second superconducting wires, two protective members each having a width larger than a width of the first and second superconducting wires and disposed on substrates sides of the first and second superconducting wires in a positional relationship of sandwiching the superconducting connecting section, and a metal part that joins the two protective members to each other. |
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Bibliography: | Application Number: US201916586313 |