CONNECTION STRUCTURE

A connection structure of the present disclosure includes first and second superconducting wires that are two superconducting wires each having a substrate in a tape shape, an intermediate layer formed on the substrate, and a superconductor layer formed on the intermediate layer, a connecting superc...

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Bibliographic Details
Main Authors YAMANO, Satoshi, SAKAMOTO, Hisaki, NAKAI, Akinobu
Format Patent
LanguageEnglish
Published 23.01.2020
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
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Summary:A connection structure of the present disclosure includes first and second superconducting wires that are two superconducting wires each having a substrate in a tape shape, an intermediate layer formed on the substrate, and a superconductor layer formed on the intermediate layer, a connecting superconductor layer that connects the first and second superconducting wires in a positional relationship in which surfaces of the superconductor layers face each other, and forms a superconducting connecting section together with the first and second superconducting wires, two protective members each having a width larger than a width of the first and second superconducting wires and disposed on substrates sides of the first and second superconducting wires in a positional relationship of sandwiching the superconducting connecting section, and a metal part that joins the two protective members to each other.
Bibliography:Application Number: US201916586313