Selective Plating of Semiconductor Package Leads

A semiconductor package having an electrically insulating mold compound body, a metal heat slug and a plurality of electrically conductive leads is provided. The heat slug has a rear surface that is exposed from the mold compound body and a die attach surface opposite the rear surface and to which a...

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Bibliographic Details
Main Authors Narayanasamy, Jayaganasan, Krishnan, Jagen, Abd Hamid, Syahir
Format Patent
LanguageEnglish
Published 16.01.2020
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package having an electrically insulating mold compound body, a metal heat slug and a plurality of electrically conductive leads is provided. The heat slug has a rear surface that is exposed from the mold compound body and a die attach surface opposite the rear surface and to which a semiconductor die is mounted. each of the leads have outer portions that are exposed from the mold compound body. The outer portions of the leads are coated with a metal coating. After completing the coating of the outer portions of the leads, a planar metallic heat sink interface surface is provided on the semiconductor device. The planar metallic heat sink interface surface is exposed from the mold compound body, thermally coupled to the semiconductor die via the heat slug, and substantially devoid of the metal coating.
Bibliography:Application Number: US201816036354