Selective Plating of Semiconductor Package Leads

A method of forming a semiconductor device includes providing a semiconductor package comprising an electrically insulating mold compound body, a semiconductor die that is encapsulated by the mold compound body, a plurality of electrically conductive leads that each protrude out of the mold compound...

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Bibliographic Details
Main Authors Schnoy, Fabian, Stoek, Thomas, Lam, Mian Mian, Narayanasamy, Jayaganasan, Krishnan, Jagen, Stuempfl, Christian, Abd Hamid, Syahir
Format Patent
LanguageEnglish
Published 16.01.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of forming a semiconductor device includes providing a semiconductor package comprising an electrically insulating mold compound body, a semiconductor die that is encapsulated by the mold compound body, a plurality of electrically conductive leads that each protrude out of the mold compound body, and a metal heat slug, the metal heat slug comprising a rear surface that is exposed from the mold compound body, coating outer portions of the leads that are exposed from the mold compound body with a metal coating, and after completing the coating of the outer portions of the leads, providing a planar metallic heat sink interface surface on the semiconductor device which is exposed from the mold compound body, and substantially devoid of the metal coating.
Bibliography:Application Number: US201916504692