MODIFIED POLYIMIDE COMPOUND, RESIN COMPOSITION AND POLYIMIDE FILM

• Main Authors: TENG, CHIA-YIN, KAO, YU-WEN, HUANG, NAN-KUN, LIN, CHING-HSUAN, HSU, MAO-FENG, HSIANG, SHOU-JUI, HO, MING-JAAN
• Format: Patent
• Language: English
• Published: 28.11.2019
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.