MODIFIED POLYIMIDE COMPOUND, RESIN COMPOSITION AND POLYIMIDE FILM

and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.

Saved in:
Bibliographic Details
Main Authors TENG, CHIA-YIN, KAO, YU-WEN, HUANG, NAN-KUN, LIN, CHING-HSUAN, HSU, MAO-FENG, HSIANG, SHOU-JUI, HO, MING-JAAN
Format Patent
LanguageEnglish
Published 28.11.2019
Subjects
ADHESIVES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CORRECTING FLUIDS
DYES
FILLING PASTES
INKS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
Online AccessGet full text

Cover

More Information
Summary:and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.
Bibliography:Application Number: US201916533932