MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS

An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located...

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Bibliographic Details
Main Authors CHIEN, Yuh-Harng, LEE, Fu-Kang, KUMMERL, Steven Alfred, CHOU, Hung-Yu
Format Patent
LanguageEnglish
Published 24.10.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.
Bibliography:Application Number: US201916459184