Sealing Structure and Sealing Method, Electronic Device and Sealing Layer Recycling Method

A sealing structure, a sealing method, an electronic device and a sealing layer recycling method are provided. The sealing structure is configured for sealing a functional device and includes a sealing layer and a stripping adhesive layer. The sealing layer covers the functional device; the strippin...

Full description

Saved in:
Bibliographic Details
Main Authors Han, Junqi, Hu, Youyuan, Wang, Xinzhu
Format Patent
LanguageEnglish
Published 03.10.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A sealing structure, a sealing method, an electronic device and a sealing layer recycling method are provided. The sealing structure is configured for sealing a functional device and includes a sealing layer and a stripping adhesive layer. The sealing layer covers the functional device; the stripping adhesive layer is bonded between the sealing layer and the functional device, and the stripping adhesive layer has a changeable stickiness to assist stripping off of the sealing layer.
Bibliography:Application Number: US201816465670