CIRCUIT ASSEMBLY
The heat dissipation of a circuit assembly is improved. A circuit assembly includes: a relay that includes a terminal and generates heat when energized/as a result of energization/due to being energized; a base member to which the relay is attached and in which a through hole is formed; a heat dissi...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
26.09.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The heat dissipation of a circuit assembly is improved. A circuit assembly includes: a relay that includes a terminal and generates heat when energized/as a result of energization/due to being energized; a base member to which the relay is attached and in which a through hole is formed; a heat dissipation member that is provided on a side of the base member opposite to a side on which the relay is attached; a first busbar that is connected to the terminal of the relay at a position spaced apart from the base member; and a heat transfer member that is inserted into the through hole so as to be movable in a direction along the axial direction of the through hole, and that comes into contact with the first busbar and the heat dissipation member. |
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Bibliography: | Application Number: US201916351041 |