SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor devices includes a first conductive layer, an organic layer, a silicon layer, a magnetic layer and a second conductive layer. The organic layer is disposed over and exposes a portion of the first conductive...

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Bibliographic Details
Main Authors Yang, Cheng-Lung, Tsai, Kun-Ming, Chen, Chen-Shien, Huang, Hon-Lin, Lin, Wei-Je, Su, CHIH-HUNG
Format Patent
LanguageEnglish
Published 26.09.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor devices includes a first conductive layer, an organic layer, a silicon layer, a magnetic layer and a second conductive layer. The organic layer is disposed over and exposes a portion of the first conductive layer. The silicon layer is disposed on and in contact with the organic layer. The magnetic layer is disposed over the first conductive layer. The second conductive layer is disposed over the organic layer and the magnetic layer to electrically connect the first conductive layer.
Bibliography:Application Number: US201815933396