METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount...

Full description

Saved in:
Bibliographic Details
Main Authors Albrecht, Peter D, Zavattari, Carlos, Bhagavat, Sumeet S, Hermes, Uwe, Tanna, Vandan
Format Patent
LanguageEnglish
Published 05.09.2019
Subjects
BROACHING
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
FILING
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
PERFORMING OPERATIONS
PHYSICS
PLANING
REGULATING
SAWING
SCRAPING
SHEARING
SLOTTING
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
Online AccessGet full text

Cover

More Information
Summary:Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.
Bibliography:Application Number: US201916414238