BONDED SUBSTRATE, SURFACE ACOUSTIC WAVE ELEMENT, SURFACE ACOUSTIC WAVE DEVICE, AND METHOD OF MANUFACTURING BONDED SUBSTRATE

A method of manufacturing a bonded substrate, which has a quartz substrate and a piezoelectric substrate bonded, includes irradiating a bonding surface of the quartz substrate and a bonding surface of the piezoelectric substrate with ultraviolet light under a pressure lower than atmosphere pressure....

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Bibliographic Details
Main Authors KURIMOTO, Kouhei, KISHIDA, Kazuhito, MIZUNO, Jun, KAKIO, Shoji, KAYANO, Rinzo
Format Patent
LanguageEnglish
Published 29.08.2019
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:A method of manufacturing a bonded substrate, which has a quartz substrate and a piezoelectric substrate bonded, includes irradiating a bonding surface of the quartz substrate and a bonding surface of the piezoelectric substrate with ultraviolet light under a pressure lower than atmosphere pressure. After the irradiation, the bonding surface of the quartz substrate and the bonding surface of the piezoelectric substrate are brought into contact. And the quartz substrate and the piezoelectric substrate are pressurized in a thickness direction to bond the bonding surfaces.
Bibliography:Application Number: US201916413356