Wafer Probe Resumption of Die Testing

Wafer test control and methodologies are provided for resuming the probing of a wafer, in connection with random, distributed or statistical wafer probing. The resumption of testing may occur after an interruption of a previous probe of the wafer and removal of the wafer from a testing chuck. Parame...

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Bibliographic Details
Main Authors Boduch, Joseph Anthony, Schmidt, Romano
Format Patent
LanguageEnglish
Published 25.07.2019
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:Wafer test control and methodologies are provided for resuming the probing of a wafer, in connection with random, distributed or statistical wafer probing. The resumption of testing may occur after an interruption of a previous probe of the wafer and removal of the wafer from a testing chuck. Parameter settings are retained in addition to probe results from the previous wafer probe session in order to construct a resume probe map according to applicable probing rules and conditions. Wafer probing may be restarted according to the resume probe map.
Bibliography:Application Number: US201916254435