Enclosure with Metal Interior Surface Layer
An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
18.07.2019
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Subjects | |
Online Access | Get full text |
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Summary: | An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit. |
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Bibliography: | Application Number: US201916360939 |