Enclosure with Metal Interior Surface Layer

An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame...

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Bibliographic Details
Main Authors Graham, Christopher S, Larsson, Karl Ruben F, Misra, Abhijeet, Kwok, Raymund W.M, Zhang, Guanglao, Wright, James A, Hill, Matthew D
Format Patent
LanguageEnglish
Published 18.07.2019
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER
COMPUTING
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
COUNTING
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SYSTEMS FOR STORING ELECTRIC ENERGY
TELEPHONIC COMMUNICATION
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Summary:An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
Bibliography:Application Number: US201916360939