BONDING AND INDEXING APPARATUS
A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
04.07.2019
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head. |
---|---|
Bibliography: | Application Number: US201816233408 |