ELECTRICALLY CONDUCTIVE PASTE AND WIRING BOARD USING THE SAME

An electrically conductive paste contains: metal nanoparticles which are protected by an organic compound containing an amino group and have an average particle diameter of 30 nm to 400 nm; metal particles which are protected by a higher fatty acid and have an average particle diameter of 1 μm to 5...

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Bibliographic Details
Main Authors YAMADA, Maki, Aoyama, Yukito, Katsumata, Rie
Format Patent
LanguageEnglish
Published 20.06.2019
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Summary:An electrically conductive paste contains: metal nanoparticles which are protected by an organic compound containing an amino group and have an average particle diameter of 30 nm to 400 nm; metal particles which are protected by a higher fatty acid and have an average particle diameter of 1 μm to 5 μm; an organic solvent; and a resin component consisting of a cellulose derivative. A conductor obtained by firing the electrically conductive paste has a film thickness of 30 μm or more and a specific resistance of 5.0×10−6 Ω·cm or less. In this way, the electrically conductive paste can reduce the resistance of the obtained conductor and to increase the amount of current flowing. A wiring board includes a conductor obtained from the electrically conductive paste.
Bibliography:Application Number: US201916284659