ELECTRICALLY CONDUCTIVE PASTE AND WIRING BOARD USING THE SAME
An electrically conductive paste contains: metal nanoparticles which are protected by an organic compound containing an amino group and have an average particle diameter of 30 nm to 400 nm; metal particles which are protected by a higher fatty acid and have an average particle diameter of 1 μm to 5...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
20.06.2019
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Subjects | |
Online Access | Get full text |
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Summary: | An electrically conductive paste contains: metal nanoparticles which are protected by an organic compound containing an amino group and have an average particle diameter of 30 nm to 400 nm; metal particles which are protected by a higher fatty acid and have an average particle diameter of 1 μm to 5 μm; an organic solvent; and a resin component consisting of a cellulose derivative. A conductor obtained by firing the electrically conductive paste has a film thickness of 30 μm or more and a specific resistance of 5.0×10−6 Ω·cm or less. In this way, the electrically conductive paste can reduce the resistance of the obtained conductor and to increase the amount of current flowing. A wiring board includes a conductor obtained from the electrically conductive paste. |
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Bibliography: | Application Number: US201916284659 |