PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT

• Main Author: KONDO, Kenta
• Format: Patent
• Language: English
• Published: 16.05.2019
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CABLES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRICITY; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INDUCTANCES; INKS; INSULATORS; MAGNETS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS; USE OF MATERIALS THEREFOR; WOODSTAINS

A photosensitive conductive paste according to the present disclosure contains a metal powder, a metal resinate containing a metal having a higher melting point than the metal powder, and a photosensitive organic component, in which the content of the metal resinate, in terms of metal, with respect to the metal powder is 0.0025% by weight or more and 1.0% by weight or less (i.e., from 0.0025% by weight to 1.0% by weight), and the content of the metal powder in the photosensitive conductive paste is 68% by weight or more and 88% by weight or less (i.e., from 68% by weight to 88% by weight).