PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT
A photosensitive conductive paste according to the present disclosure contains a metal powder, a metal resinate containing a metal having a higher melting point than the metal powder, and a photosensitive organic component, in which the content of the metal resinate, in terms of metal, with respect...
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Main Author | |
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Format | Patent |
Language | English |
Published |
16.05.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A photosensitive conductive paste according to the present disclosure contains a metal powder, a metal resinate containing a metal having a higher melting point than the metal powder, and a photosensitive organic component, in which the content of the metal resinate, in terms of metal, with respect to the metal powder is 0.0025% by weight or more and 1.0% by weight or less (i.e., from 0.0025% by weight to 1.0% by weight), and the content of the metal powder in the photosensitive conductive paste is 68% by weight or more and 88% by weight or less (i.e., from 68% by weight to 88% by weight). |
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Bibliography: | Application Number: US201816228584 |