RESIN COMPOSITION

A resin composition including: (A) 100 parts by mass of a resin selected from the group consisting of polyamide, polylactic acid, and polyphenylene sulfide each having a melting point of 170° C. to 370° C.; (B) 0.05 to 5.0 parts by mass of a triazine compound represented by general formula (1); (C)...

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Bibliographic Details
Main Authors AYABE, Takashi, AKATSU, Hiroki
Format Patent
LanguageEnglish
Published 16.05.2019
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:A resin composition including: (A) 100 parts by mass of a resin selected from the group consisting of polyamide, polylactic acid, and polyphenylene sulfide each having a melting point of 170° C. to 370° C.; (B) 0.05 to 5.0 parts by mass of a triazine compound represented by general formula (1); (C) 0 to 3.0 parts by mass of a specific oxidizing agent; and (D) 0 to 1.0 part by mass of a specific light stabilizer.
Bibliography:Application Number: US201716304454