RESIN COMPOSITION
A resin composition including: (A) 100 parts by mass of a resin selected from the group consisting of polyamide, polylactic acid, and polyphenylene sulfide each having a melting point of 170° C. to 370° C.; (B) 0.05 to 5.0 parts by mass of a triazine compound represented by general formula (1); (C)...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
16.05.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A resin composition including: (A) 100 parts by mass of a resin selected from the group consisting of polyamide, polylactic acid, and polyphenylene sulfide each having a melting point of 170° C. to 370° C.; (B) 0.05 to 5.0 parts by mass of a triazine compound represented by general formula (1); (C) 0 to 3.0 parts by mass of a specific oxidizing agent; and (D) 0 to 1.0 part by mass of a specific light stabilizer. |
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Bibliography: | Application Number: US201716304454 |