ADHESIVE FORMULATIONS WITH IMPROVED THERMAL AND BONDING PROPERTIES

The present invention refers to a composition comprising: (a) 5-95 wt % of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30° C. and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt % of poly(alkylen...

Full description

Saved in:
Bibliographic Details
Main Authors Arandilla Colias, Borja, Marin Perales, Laura, Segura Fernandez, Sonia, RUIZ ORTA, Carolina, Garcia Ruiz, Monica, MARTIN MARTINEZ, Jose Miguel, Yanez Pacios, Andres Jesus
Format Patent
LanguageEnglish
Published 09.05.2019
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
Online AccessGet full text

Cover

More Information
Summary:The present invention refers to a composition comprising: (a) 5-95 wt % of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30° C. and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt % of poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature higher than 30° C. It also refers to a method for producing said composition as well as to its use for preparing adhesive formulations with improved thermal stability and adhesion properties.
Bibliography:Application Number: US201716096176