LASER PROCESSING APPARATUS

• Main Authors: Kang, Taekkyo, Choi, Minkyu, Han, Gyoowan, Myoung, Seungho, Kim, Do-sun
• Format: Patent
• Language: English
• Published: 02.05.2019
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CLEANING; CLEANING IN GENERAL; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A laser processing apparatus may include: a laser generator configured to generate a laser beam; a stage configured to support a target object; at least one supply nozzle on the stage to eject an air toward the stage; a suction unit configured to inhale external air; and a suction structure on the stage and adjacent to the at least one supply nozzle. The suction structure may include a suction hole connected to the suction unit to inhale the external air. The suction structure may include an inclined surface in which the suction hole is defined. The suction structure may include a first surface adjacent to the supply nozzle, and an opening may be defined in a region of the first surface adjacent to a bottom surface. A distance between the inclined surface and the target object may be less than or equal to a height of the opening.