FILLING MATERIAL, RESIN COMPOSITION, PACKAGE, LIGHT-EMITTING DEVICE, AND METHODS OF MANUFACTURING SAME

A filling material for a resin composition includes a base material, a coating material coating at least a portion of a surface of a particle of the base material, and a light-reflective material disposed on the surface of the particle of the base material and supported by the coating material. The...

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Bibliographic Details
Main Authors OKADA, Koichi, AKAZAWA, Yuji
Format Patent
LanguageEnglish
Published 28.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A filling material for a resin composition includes a base material, a coating material coating at least a portion of a surface of a particle of the base material, and a light-reflective material disposed on the surface of the particle of the base material and supported by the coating material. The base material comprises a first inorganic compound containing a Group II element. The coating material comprises a second inorganic compound containing the Group II element. The second inorganic compound is different from the first inorganic compound. The light-reflective material comprises a third inorganic compound having a refractive index higher than a refractive index of the first inorganic compound. A method of manufacturing the filling material is provided. A resin composition comprising the filling material, a package, a light-emitting device, and methods of manufacturing them are also provided.
Bibliography:Application Number: US201816117930