A METHOD AND AN APPARATUS FOR TREATING A SURFACE OF A TCO MATERIAL IN A SEMICONDUCTOR DEVICE

The present disclosure provides a method for treating a surface portion of a TCO material in a semiconductor device that comprises a structure arranged to facilitate current flow in one direction. To perform the method the surface portion of the TCO is exposed to an electrolyte and a current is indu...

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Bibliographic Details
Main Authors Lennon, Alison Joan, Allen, Vincent Akira
Format Patent
LanguageEnglish
Published 28.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure provides a method for treating a surface portion of a TCO material in a semiconductor device that comprises a structure arranged to facilitate current flow in one direction. To perform the method the surface portion of the TCO is exposed to an electrolyte and a current is induced in the device. The current allows reducing the TCO material in a manner such that the adhesion of a metallic material to the exposed surface portion is improved over the adhesion of the metallic material to a non-exposed surface portion.
Bibliography:Application Number: US201716080055