ENHANCING DIE FLATNESS
Methods and apparatus for enhancing the flatness of a die by applying adhesive to a shim having a selected flatness, rotating the shim to spread the adhesive to a layer having a uniform thickness, evacuating a chamber to create a vacuum; manipulating a die onto the adhesive layer in the chamber; and...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
28.02.2019
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Subjects | |
Online Access | Get full text |
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Summary: | Methods and apparatus for enhancing the flatness of a die by applying adhesive to a shim having a selected flatness, rotating the shim to spread the adhesive to a layer having a uniform thickness, evacuating a chamber to create a vacuum; manipulating a die onto the adhesive layer in the chamber; and reducing a level of the vacuum to pressure the die onto the adhesive layer such that the bow in the die is reduced as the die conforms to the shim. |
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Bibliography: | Application Number: US201715827220 |