SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A method for manufacturing a semiconductor package includes: (a) providing a package device, the package device comprising a substrate, a package body and a plurality of connecting elements, the substrate having a first surface, the package body being disposed adjacent to the first surface of the su...

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Bibliographic Details
Main Authors SU, Chin-An, LEE, Chia-Ling, LIU, Cheng-Hua, SUN, Ming-Wei
Format Patent
LanguageEnglish
Published 21.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for manufacturing a semiconductor package includes: (a) providing a package device, the package device comprising a substrate, a package body and a plurality of connecting elements, the substrate having a first surface, the package body being disposed adjacent to the first surface of the substrate, and the connecting elements being disposed adjacent to the first surface of the substrate and encapsulated by the package body; and (b) removing a portion of the package body along one or more machining paths to expose the connecting elements, wherein each machining path has one or more first paths passing over, between, or along a side of at least two connecting elements, wherein a portion of each of the at least two connecting elements is within the package body, and another portion of each of the at least two connecting elements protrudes from a surface of the package body.
Bibliography:Application Number: US201816168825