POLYAMIDE RESIN AND FILM COMPRISING THE SAME

Provided is a polyamide resin having excellent heat shrinkability. A polyamide resin which contains three or more types of units, wherein the polyamide resin comprises (A) units derived from a lactam and/or an aminocarboxylic acid, and (B) units derived from an equimolar salt of a diamine and a dica...

Full description

Saved in:
Bibliographic Details
Main Authors HANAOKA, Yasunari, MAEDA, Shuichi, WADA, Shusaku, NAKAGAWA, Tomoyuki
Format Patent
LanguageEnglish
Published 21.02.2019
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:Provided is a polyamide resin having excellent heat shrinkability. A polyamide resin which contains three or more types of units, wherein the polyamide resin comprises (A) units derived from a lactam and/or an aminocarboxylic acid, and (B) units derived from an equimolar salt of a diamine and a dicarboxylic acid, wherein (B) the units derived from an equimolar salt of a diamine and a dicarboxylic acid comprise (B-1) units having no alicyclic structure and (B-2) units having an alicyclic structure.
Bibliography:Application Number: US201716073045