ANTIREFLECTION STRUCTURE FOR INTEGRATED LASER DIODE/PHOTONIC CHIP INTERFACE

A method of manufacturing a LIDAR chip and applying an anti-reflection (AR) coating to a coupling structure of the LIDAR chip. The coupling structure if formed on a wafer. A pocket is formed in the wafer adjacent the coupling structure. The AR material is deposited on top of the wafer and coupling s...

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Bibliographic Details
Main Authors Sayyah, Keyvan, Huang, Biqin, Patterson, Pamela R
Format Patent
LanguageEnglish
Published 14.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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Summary:A method of manufacturing a LIDAR chip and applying an anti-reflection (AR) coating to a coupling structure of the LIDAR chip. The coupling structure if formed on a wafer. A pocket is formed in the wafer adjacent the coupling structure. The AR material is deposited on top of the wafer and coupling structure. The AR material is etched to form the AR coating on the coupling structure.
Bibliography:Application Number: US201816018852