MOISTURE CURABLE COMPOSITIONS

A two part moisture curing composition, exhibiting low thermal conductivity, has a part A) and a part B). Part A) comprises either: 1) a siloxane polymer (I) having at least two terminal hydroxyl or hydrolysable groups and a viscosity of from 20,000 to 40,000 mPa·s at 25° C.; or 2) a polymer mixture...

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Bibliographic Details
Main Authors DEI SANTI, Davide, GUBBELS, Frederic
Format Patent
LanguageEnglish
Published 14.02.2019
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Summary:A two part moisture curing composition, exhibiting low thermal conductivity, has a part A) and a part B). Part A) comprises either: 1) a siloxane polymer (I) having at least two terminal hydroxyl or hydrolysable groups and a viscosity of from 20,000 to 40,000 mPa·s at 25° C.; or 2) a polymer mixture (II) of polymer (i) a siloxane polymer having at least two terminal hydroxyl or hydrolysable groups and a viscosity ≥25,000 mPa·s at 25° C., and polymer (ii) a siloxane polymer having at least two terminal hydroxyl or hydrolysable groups and a viscosity of between 1,000 and 20,000 mPa·s at 25° C. Part A) further comprises a reinforcing filler and a low-density filler, the total filler content being between 30 and 45% in volume of the total composition. Part B) comprises a moisture curing agent formulation comprising a tin based catalyst and one or more crosslinkers.
Bibliography:Application Number: US201716085758