Cu-BASED SINTERED SLIDING MATERIAL, AND PRODUCTION METHOD THEREFOR

The Cu-based sintered sliding material has a composition including, by mass %, 7% to 35% of Ni, 1% to 10% of Sn, 0.9% to 3% of P, and 0.5% to 5% of C, with a remainder of Cu and inevitable impurities, wherein the Cu-based sintered sliding material includes a sintered body including: alloy grains tha...

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Bibliographic Details
Main Author ISHII, Yoshinari
Format Patent
LanguageEnglish
Published 31.01.2019
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Summary:The Cu-based sintered sliding material has a composition including, by mass %, 7% to 35% of Ni, 1% to 10% of Sn, 0.9% to 3% of P, and 0.5% to 5% of C, with a remainder of Cu and inevitable impurities, wherein the Cu-based sintered sliding material includes a sintered body including: alloy grains that contain Sn and C and contain a Cu-Ni-based alloy as a main component; grain boundary phases that contain Ni and P as main components and are dispersedly distributed in grain boundaries of the alloy grains; and free graphite that intervenes at the grain boundaries of the alloy grains, the Cu-based sintered sliding material has a structure in which pores are dispersedly formed in the grain boundaries of the alloy grains, and an amount of C in a metal matrix including the alloy grains and the grain boundary phases is, by mass %, 0.02% to 0.20%.
Bibliography:Application Number: US201716073563