WIRING SUBSTRATE

A wiring substrate includes a coil wiring and a magnetic layer that is in contact with a lower surface of the coil wiring and includes an opening extending through in a thickness-wise direction. The wiring substrate further includes a first insulation layer covering the coil wiring, an upper surface...

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Bibliographic Details
Main Authors NAKAZAWA, Shinji, AOKI, Toshiaki
Format Patent
LanguageEnglish
Published 27.12.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A wiring substrate includes a coil wiring and a magnetic layer that is in contact with a lower surface of the coil wiring and includes an opening extending through in a thickness-wise direction. The wiring substrate further includes a first insulation layer covering the coil wiring, an upper surface of the magnetic layer, and a wall surface of the opening and a signal wiring structure formed so that a signal of a semiconductor element, when mounted on the wiring substrate, travels through the opening of the magnetic layer. The signal wiring structure includes a first wiring portion located on an upper surface of the first insulation layer and a first via wiring located inward from the opening of the magnetic layer and connected to the first wiring portion. The magnetic layer is not in contact with the signal wiring structure.
Bibliography:Application Number: US201815975990