SILOXANE RESIN COMPOSITIONS

Addition curable silicone resin compositions have excellent processing characteristics, and can be used to encapsulate electrical and electronic devices.

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Bibliographic Details
Main Authors JOO, Young-Hyuk, SANDMEYER, Frank, KUHN, Arvid, YANG, Hyun-Kwan
Format Patent
LanguageEnglish
Published 27.12.2018
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Addition curable silicone resin compositions have excellent processing characteristics, and can be used to encapsulate electrical and electronic devices.
Bibliography:Application Number: US201616063411