THERMAL INTERFACE MATERIAL

Low Volatile Organic Content (VOC) thermal interface materials are described. The thermal interface materials include heat conducting fillers such a hexagonal boron nitride dispersed in a block copolymer resin system. Depending on the requirements, tackifiers and plasticizers may be included in the...

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Bibliographic Details
Main Authors BIEBER, Pierre R, EICHLER, Jens, SCHILLER, Marion
Format Patent
LanguageEnglish
Published 20.12.2018
Subjects
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:Low Volatile Organic Content (VOC) thermal interface materials are described. The thermal interface materials include heat conducting fillers such a hexagonal boron nitride dispersed in a block copolymer resin system. Depending on the requirements, tackifiers and plasticizers may be included in the resin system while still retaining low VOC levels.
Bibliography:Application Number: US201616061845