LIGHT-EMITTING ELEMENT PACKAGE AND LIGHTING DEVICE

• Main Authors: YU, Dong Hyun, KANG, Kyung Ho, YUN, Nae Sang, CHOE, Meen Soo
• Format: Patent
• Language: English
• Published: 13.12.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments relate to a light emitting device package and a lighting device. The light emitting device package of an embodiment includes: a first lead frame; a light emitting device mounted on the first lead frame; a second lead frame spaced apart from the first lead frame in a first direction; a protective device mounted on the second lead frame; and a body coupled to the first and second lead frames, wherein the first lead frame includes a first stepped portion disposed along an edge of a lower surface thereof, and the second lead frame includes a third stepped portion disposed along an edge of a lower surface thereof, a mounting region of the protective device which is not overlapped in a vertical direction and spaced apart from the third stepped portion, and a second wire recess portion which is partially overlapped with the third stepped portion in the vertical direction, wherein the first and third stepped portions may be disposed in the body to improve injection molding into a spaced space between the first lead frame and second lead frame. That is, in an embodiment, an edge portion or a curved surface portion may be disposed around a spaced space of the first and second lead frames to improve injection molding defects, thereby improving productivity.