PROCESS FOR FABRICATING SILICON NANOSTRUCTURES

A process for etching a substrate comprising polycrystalline silicon to form silicon nanostructures includes depositing metal on top of the substrate and contacting the metallized substrate with an etchant aqueous solution comprising about 2 to about 49 weight percent HF and an oxidizing agent.

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Bibliographic Details
Main Authors Buchine, Brent A, Black, Marcie R, Modawar, Faris
Format Patent
LanguageEnglish
Published 06.12.2018
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Summary:A process for etching a substrate comprising polycrystalline silicon to form silicon nanostructures includes depositing metal on top of the substrate and contacting the metallized substrate with an etchant aqueous solution comprising about 2 to about 49 weight percent HF and an oxidizing agent.
Bibliography:Application Number: US201816054457