INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

An interconnect structure includes a first substrate including a first surface, a second surface opposite to the first surface, a cavity extended through the first substrate, and a first recess extended from the second surface towards the first surface; a second substrate disposed opposite to the se...

Full description

Saved in:
Bibliographic Details
Main Authors YU, HSIU-MEI, CHENG, CHIA-JEN
Format Patent
LanguageEnglish
Published 29.11.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An interconnect structure includes a first substrate including a first surface, a second surface opposite to the first surface, a cavity extended through the first substrate, and a first recess extended from the second surface towards the first surface; a second substrate disposed opposite to the second surface of the first substrate; an electronic device disposed within the cavity; a first polymeric layer disposed over the first surface and within the cavity of the first substrate; and a second polymeric layer disposed between the first substrate and the second substrate and within the first recess.
Bibliography:Application Number: US201715842498