METHOD OF PROCESSING SUBSTRATE

A method of processing a substrate includes attaching a first surface of a planarization film to a processing target substrate, disposing an electrostatic carrier onto a second surface opposite the first surface of the planarization film, fixing the processing target substrate to the electrostatic c...

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Bibliographic Details
Main Authors Inada, Satoshi, Song, Yoon-seok, Saimoto, Yoshihisa, Lee, Kyung-hak, Jung, Ki-hyun, Lyu, Je-kook
Format Patent
LanguageEnglish
Published 22.11.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of processing a substrate includes attaching a first surface of a planarization film to a processing target substrate, disposing an electrostatic carrier onto a second surface opposite the first surface of the planarization film, fixing the processing target substrate to the electrostatic carrier by supplying power to the electrostatic carrier, and performing processing on the processing target substrate.
Bibliography:Application Number: US201815871620