GRADED MIDPLANE
An electronic module includes, a circuit board having front and rear edges, and first and second connectors. The rear edge includes, (i) a first section at a first distance from the front edge, and (ii) a second section at a second distance from the front edge, different from the first distance. The...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
01.11.2018
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Subjects | |
Online Access | Get full text |
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Summary: | An electronic module includes, a circuit board having front and rear edges, and first and second connectors. The rear edge includes, (i) a first section at a first distance from the front edge, and (ii) a second section at a second distance from the front edge, different from the first distance. The first and second connectors are mounted along the rear edge at the first and second sections, respectively, and are configured to connect the circuit board to an interconnect unit. |
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Bibliography: | Application Number: US201715582705 |