Integrated Circuit Substrate and Method for Manufacturing the Same

An integrated circuit substrate and a method for manufacturing the same are disclosed. In an embodiment a method includes providing a wafer having a plurality of active areas, each active area being provided in a separate die area and for each active area, providing a code pattern outside the active...

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Main Authors Stranzl, Gudrun, Roesner, Michael, Engelhardt, Manfred, Zgaga, Martin
Format Patent
LanguageEnglish
Published 01.11.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract An integrated circuit substrate and a method for manufacturing the same are disclosed. In an embodiment a method includes providing a wafer having a plurality of active areas, each active area being provided in a separate die area and for each active area, providing a code pattern outside the active area, the code pattern being associated with the die area.
AbstractList An integrated circuit substrate and a method for manufacturing the same are disclosed. In an embodiment a method includes providing a wafer having a plurality of active areas, each active area being provided in a separate die area and for each active area, providing a code pattern outside the active area, the code pattern being associated with the die area.
Author Zgaga, Martin
Roesner, Michael
Stranzl, Gudrun
Engelhardt, Manfred
Author_xml – fullname: Stranzl, Gudrun
– fullname: Roesner, Michael
– fullname: Engelhardt, Manfred
– fullname: Zgaga, Martin
BookMark eNqNyr8KwjAQgPEMOvjvHQ6cBWMRXbUoOnSKzuWaXNqAXkpyeX8RfACnD358czXhyDRT5zsL9QmFHNQh2RIETOmyfAmQHTQkQ3TgY4IGuXi0UlLgHmQgMPimpZp6fGVa_bpQ6-vlUd82NMaW8oiWmKR9mt1WHyu9P-jqpKv_rg8EADRm
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2018315713A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2018315713A13
IEDL.DBID EVB
IngestDate Fri Jul 19 16:33:54 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2018315713A13
Notes Application Number: US201816029934
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181101&DB=EPODOC&CC=US&NR=2018315713A1
ParticipantIDs epo_espacenet_US2018315713A1
PublicationCentury 2000
PublicationDate 20181101
PublicationDateYYYYMMDD 2018-11-01
PublicationDate_xml – month: 11
  year: 2018
  text: 20181101
  day: 01
PublicationDecade 2010
PublicationYear 2018
RelatedCompanies Infineon Technologies AG
RelatedCompanies_xml – name: Infineon Technologies AG
Score 3.1791668
Snippet An integrated circuit substrate and a method for manufacturing the same are disclosed. In an embodiment a method includes providing a wafer having a plurality...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Integrated Circuit Substrate and Method for Manufacturing the Same
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181101&DB=EPODOC&locale=&CC=US&NR=2018315713A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1dS8MwFL2MKeqbTsWPKQGlb0VG0y19GGLTlSl0G26TvY2kTaGg2dg6_PvexE73tLd8QEhCTu69ac-5AI85VULS3HfTvJO5NMikKxBGrkeZ6rB2kAlpCM7JoN2f0reZP6vB55YLY3VCv604IiIqRbyX9r5e_j9iRfbfyvWTLLBp8RxPupFTRcdorvCIOVHY7Y2G0ZA7nHenY2fwbvu8lo8h2QvGSgfGkTZK-72P0PBSlrtGJT6FwxGOp8szqCndgGO-zb3WgKOk-uSNxQp963MIX7faDhnhxSrdFCUxwLcCs0TojCQ2HzRBR5QkQm8Ma8HSEAm6eWQsvtQFPMS9Ce-7OJn539rn0_HuzL1LqOuFVldAApPKy2sZAT6PdqiUqfJZ0M49ppigKbuG5r6RbvZ338KJqf6S7ppQL1cbdYfWt5T3dtN-AECciWs
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3fS8MwED7GFOebTsUfUwNK34qMpr8ehrh2o9N1G66VvY2kTWGg3dha_Pe9xE73tLeQg5CEfLm7Nt93AI8ZFYzTzNSTzE516qZcZwgj3aCOsB3LTRmXBOdwZAUxfZ2Zsxp8brkwSif0W4kjIqISxHuh7uvV_0csX72t3DzxBXYtn_tRx9eq7BjdFR4xze92epOxP_Y0z-vEU230rmxG28SU7AVzpQNb6vPK4OmjK3kpq12n0j-BwwmOlxenUBN5ExretvZaE47C6pc3Niv0bc6gO9hqO6TEW6yTclEQCXwlMEtYnpJQ1YMmGIiSkOWlZC0oGiLBMI9M2Zc4h4d-L_ICHScz_1v7PJ7uzty4gHq-zMUlEFeW8jLaUoDPoDblPBGm41qZ4QiH0cS5gta-ka73m--hEUThcD4cjN5u4Fiafgl4LagX61Lcoicu-J3awB_WxoxY
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Integrated+Circuit+Substrate+and+Method+for+Manufacturing+the+Same&rft.inventor=Stranzl%2C+Gudrun&rft.inventor=Roesner%2C+Michael&rft.inventor=Engelhardt%2C+Manfred&rft.inventor=Zgaga%2C+Martin&rft.date=2018-11-01&rft.externalDBID=A1&rft.externalDocID=US2018315713A1