Integrated Circuit Substrate and Method for Manufacturing the Same

An integrated circuit substrate and a method for manufacturing the same are disclosed. In an embodiment a method includes providing a wafer having a plurality of active areas, each active area being provided in a separate die area and for each active area, providing a code pattern outside the active...

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Bibliographic Details
Main Authors Stranzl, Gudrun, Roesner, Michael, Engelhardt, Manfred, Zgaga, Martin
Format Patent
LanguageEnglish
Published 01.11.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit substrate and a method for manufacturing the same are disclosed. In an embodiment a method includes providing a wafer having a plurality of active areas, each active area being provided in a separate die area and for each active area, providing a code pattern outside the active area, the code pattern being associated with the die area.
Bibliography:Application Number: US201816029934