Apparatus and Method for Decapsulating Packaged Integrated Circuits

A system for decapsulating a portion of an encapsulated integrated circuit that includes copper elements has a container holding an etchant solution, a pump having an inlet port connected to the container holding an etchant solution, and an outlet port, a heat exchanger having an inlet port connecte...

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Bibliographic Details
Main Author Martin, Kirk Alan
Format Patent
LanguageEnglish
Published 04.10.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A system for decapsulating a portion of an encapsulated integrated circuit that includes copper elements has a container holding an etchant solution, a pump having an inlet port connected to the container holding an etchant solution, and an outlet port, a heat exchanger having an inlet port connected to the pump outlet port, and an outlet port from the heat exchanger, and control circuitry controlling temperature of the etchant to be at or below ambient temperature by controlling temperature of the heat exchanger.
Bibliography:Application Number: US201815997373