FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

Wafers include multiple bulk redistribution layers. A contact pad is formed on a surface of one of the bulk redistribution layers. A final redistribution layer is formed on the surface and in contact with the contact pad. Solder is formed on the contact pad. The solder includes a pedestal portion fo...

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Bibliographic Details
Main Authors Aoki, Toyohiro, Nakamura, Eiji I, Hisada, Takashi
Format Patent
LanguageEnglish
Published 20.09.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Wafers include multiple bulk redistribution layers. A contact pad is formed on a surface of one of the bulk redistribution layers. A final redistribution layer is formed on the surface and in contact with the contact pad. Solder is formed on the contact pad. The solder includes a pedestal portion formed to a same height as the final redistribution layer and a ball portion above the pedestal portion.
Bibliography:Application Number: US201815987029