ASSEMBLY OF SEMICONDUCTOR AND HIGHLY THERMALLY CONDUCTIVE HEAT-DISSIPATING SUBSTRATES

• Main Authors: LIN, Hsing-Yen, LAW, Pi-Cheng, LIU, Bo-Wei, HUANG, Po-Chao, SU, Hua-Hsin, DENG, Ya-Hsin
• Format: Patent
• Language: English
• Published: 30.08.2018
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRICITY

An assembly of semiconductor and highly thermally conductive heat-dissipating substrates includes a thermally conductive metal substrate, a supporting substrate, and a vertical heat-dissipating block. The thermally conductive metal substrate comprises a substrate body, a receiving groove in the substrate body, and a thin-layer portion at a bottom side of the receiving groove. The supporting substrate is provided in the receiving groove. The two vertically opposite sides of the supporting substrate respectively form a carrying surface for carrying a laser diode LD and a heat-dissipating surface in contact with the thin-layer portion at the bottom side of the receiving groove. The vertical heat-dissipating block is provided on a side of the thermally conductive metal substrate opposing to a side with the receiving groove.