TECHNOLOGIES FOR INVERTING LITHOGRAPHIC PATTERNS AND SEMICONDUCTOR DEVICES INCLUDING HIGH ASPECT RATIO STRUCTURES

Technologies for inverting lithographic patterns are described. In some embodiments the technologies include a method for inverting a lithographic pattern of hole precursors, so as to form one or more high aspect ratio structures on or in a surface of a substrate.

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Bibliographic Details
Main Authors ST. AMOUR, ANTHONY A, AUTH, CHRISTOPHER P
Format Patent
LanguageEnglish
Published 30.08.2018
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Summary:Technologies for inverting lithographic patterns are described. In some embodiments the technologies include a method for inverting a lithographic pattern of hole precursors, so as to form one or more high aspect ratio structures on or in a surface of a substrate.
Bibliography:Application Number: US201515755466