PICKUP APPARATUS

According to one embodiment, a pickup apparatus picks up one of a plurality of semiconductor chips from a sheet. The plurality of semiconductor chips is adhered to an upper surface of the sheet. The pickup apparatus includes a supporter, a presser, a suction-holder, and a lifter. The supporter is co...

Full description

Saved in:
Bibliographic Details
Main Authors Sogou, Takahiro, Hiyama, Kohei
Format Patent
LanguageEnglish
Published 09.08.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:According to one embodiment, a pickup apparatus picks up one of a plurality of semiconductor chips from a sheet. The plurality of semiconductor chips is adhered to an upper surface of the sheet. The pickup apparatus includes a supporter, a presser, a suction-holder, and a lifter. The supporter is configured to support another of the semiconductor chips from below. The other semiconductor chip is positioned adjacent to the one semiconductor chip. The presser is configured to press the other semiconductor chip from above. The other semiconductor chip is clamped between the presser and the supporter. The suction-holder is configured to be movable upward with respect to the presser. The suction-holder holds the one semiconductor chip from above. The lifter is configured to lift the one semiconductor chip from below. The lifter urges the one semiconductor chip to peel from the sheet.
Bibliography:Application Number: US201815888497